<ul><li>Apple is set to release the A20 chip built on TSMC's second-gen 2nm process, offering improved performance and power efficiency for tasks like AI processing and gaming.</li><li>The A20 chip in iPhone 18 Pro models is expected to feature a new packaging technology called Wafer-Level Multi-Chip Module (WMCM), allowing better integration of components like SoC and DRAM.</li><li>The move to WMCM packaging represents a significant advancement in chip design for Apple and suggests that advanced technologies are now entering the mobile market.</li><li>Apple's adoption of 2nm chip technology and WMCM packaging signals a significant leap in chip design and performance, indicating a potential edge over competitors in upcoming smartphone releases.</li></ul>

Apple’s 2nm A20 chip will sport new packaging breakthrough

Discover more