Chinese memory chip maker YMTC has published nearly 20 new patent applications for processes to advance computing efficiency and optimize chip-making structures.
The patents include improvements in stacking structures, shielding from electromagnetic interference, and methods to boost storage density.
YMTC has developed innovations with its Xtacking4.0 process, aiming to enhance storage density, speed, and energy efficiency.
Chinese companies are striving to create independent intellectual property in the semiconductor industry amid US trade sanctions.