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Image Credit: Semiengineering

Chip Industry Technical Paper Roundup: Nov. 25

  • New technical papers recently added to Semiconductor Engineering’s library:
  • 1. Parameters of performance: A deep dive into liquid-to-air CDU assessment - Binghamton University-SUNY and NVIDIA
  • 2. Spiking Transformer Hardware Accelerators in 3D Integration - UC Santa Barbara, Georgia Tech and Burapha University
  • 3. Sustainable Hardware Specialization - National University of Singapore and Ghent University
  • 4. Design Decoupling of Inner-and Outer-Gate Lengths in Nanosheet FETs for Ultimate Scaling - Belgium Research Center, Huawei Technologies and Global TCAD Solutions

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