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Chip Industry Week In Review
- Cohu is set to buy process control and analytics software firm Tignis.
- NXP will acquire UK-based Aviva Links for $242.5mn cash, in a deal expected to close during H1 2025.
- The US Dept. of Commerce will provide up to $406m CHIPS Act funding to GlobalWafers America and MEMC to support the construction of silicon wafer manufacturing facilities in Texas and Missouri.
- The DoC finalised an award to SK Hynix for up to $458m CHIPS Act funding to build a memory packaging plant and R&D facility in West Lafayette, Indiana.
- MIT engineers have developed a faster multi-layer chip creation technique, without bulky silicon wafers via stacking high-quality semiconducting material directly on top of each other, increasing processing performance.
- Cadstrom has raised $6.8m in seed funding for its AI validation tools for electronic hardware and PCB design.
- Synopsys and SiMa.ai are teaming up on a solution for automotive companies that combines Synopsys’ EDA tools, auto-grade IP, and hardware-assisted verification solutions with SiMa.ai’s machine learning accelerator IP and software stack.
- Infineon will supply a complete chipset to battery manufacturer, Eve Energy, as part of a collaboration on automotive battery management systems.
- IBM surveyed automakers to explore the shift to software-defined vehicles which is facing technical and cultural challenges.
- Microchip Technology announced a line of CAN FD System Basis Chips with an integrated high-speed CAN FD transceiver and 5V LDO.
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