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Chip Industry Week In Review
- McKinsey reported potential shortages of high-purity materials like tungsten, aluminum, and copper in the U.S. semiconductor supply chain.
- CSIS discussed the importance of U.S.-DRC cooperation to counter China's dominance in semiconductor materials.
- SEMI forecasts a rise in global fab equipment spending driven by AI integration and HPC demand, with China leading in spending.
- The U.S. Department of Commerce added 80 entities, including Huawei, to its export blacklist for advanced technologies.
- Siemens completed the acquisition of Altair to enhance its Xcelerator platform with new simulation capabilities.
- imec introduced a new DRAM bit cell without a capacitor for high-density 3D DRAM and embedded DRAM.
- Alphawave Semi unveiled a range of optoelectronics products for high-speed interconnects.
- Quest Global will utilize Rapidus' 2nm GAA manufacturing process for low power AI chips.
- First-time silicon success rates are declining due to increased complexity in chip design and customization.
- Interposers and substrates are transforming into engineered platforms with new functionalities like power distribution and signal integrity.
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