Enfabrica Corporation has raised $115m in Series C funding, led by Spark Capital, to take artificial intelligence (AI) infrastructure to the next level.
In addition, Enfabrica announced the launch of the Accelerated Compute Fabric (ACF) SuperNIC chip, potentially the industry's first networking card that can process 3.2 terabits per second.
Enfabrica plans to use the funds to ramp up production of the chip and expand its R&D capability.
The ACF SuperNIC provides a software-defined networking system, giving data centre operators full-stack control and programmability over their infrastructure.
Enfabrica's investors include Atreides Management, Alumni Ventures, Liberty Global Ventures, Sutter Hill Ventures, and Valor Equity Partners.
The chip's design allows data centres to scale up to 500,000 graphic processing units while maintaining low latency and optimised performance.
It provides an 800-Gigabit Ethernet connectivity for multi-port and multipath resiliency, establishing Enfabrica as a leading innovator in scalable AI networking solutions.
Enfabrica's funding comes during a period of rapid investor interest, following a successful Series B funding round of $125m in September 2023.
Enfabrica's ACF SuperNIC chip is available in Q1 of 2025 and will partner with OEM and ODM systems for full-scale commercial availability later that year.
Through this breakthrough technology, Enfabrica is anticipating improving the efficiency, resiliency and scalability of AI clusters globally.