Foxconn, known as Hon Hai Technology Group, has announced a partnership with Thales Group at a French economic summit hosted by President Macron.
The partnership aims to establish an outsourced semiconductor assembly and test (OSAT) facility in Europe with an investment exceeding €250 million.
Foxconn is in talks with Thales and Radiall to develop the facility, focusing on fan-out wafer-level packaging for aerospace, automotive, space telecoms, and defense markets.
Additionally, Foxconn has teamed up with Thales Alenia Space to explore high-volume satellite manufacturing for telecommunications projects in low-Earth orbit.