Security concerns in analog circuits are gaining attention with the move towards multi-die assemblies and the importance of sensor data at the edge.
Analog circuits traditionally had limited space on-chip, pushing security concerns towards digital circuits.
Shift towards multi-dimensional SiPs has eased area restrictions for analog circuits, allowing for more freedom in development and potential for increased reuse.
The integration of analog circuits in multi-die assemblies poses new security challenges and vulnerabilities to cyber attacks.
Chiplet I/Os facilitate potentially vulnerable subsystem-to-subsystem communications in complex assemblies.
Ensuring security in multi-die assemblies, particularly in the context of AI, is crucial for safeguarding against counterfeits and side-channel attacks.
Securing analog circuits at the edge, where AI/ML expansion is sensor-driven, involves implementing cryptographic operations in sensors and ML models.
Analog data security at the edge mirrors digital data security concerns and involves verifying source authenticity and monitoring sensors for degradation or attacks.
The disparity between digital and analog engineering domains poses unique security challenges, especially in evolving multi-die assembly environments.
Ensuring analog security is as robust as digital security is imperative as chiplets become more prevalent in heterogeneous systems.