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Intel’s upcoming Arrow Lake CPUs might run into cooling trouble

  • Intel's upcoming Arrow Lake CPUs, set to compete among the best processors, might face cooling trouble.
  • The hot spot on Arrow Lake CPUs is situated at the top of the package, posing potential cooling challenges.
  • The LGA 1851 socket used by Arrow Lake CPUs is reportedly the same size as the LGA 1700 socket, allowing compatibility with most existing coolers.
  • For overclockers, adjusting the cooling center and orientation of the CPU cooler might be crucial to achieve optimal performance.

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