Intel's upcoming Arrow Lake CPUs, set to compete among the best processors, might face cooling trouble.The hot spot on Arrow Lake CPUs is situated at the top of the package, posing potential cooling challenges.The LGA 1851 socket used by Arrow Lake CPUs is reportedly the same size as the LGA 1700 socket, allowing compatibility with most existing coolers.For overclockers, adjusting the cooling center and orientation of the CPU cooler might be crucial to achieve optimal performance.