<ul><li>Kaynes Semicon, a subsidiary of Kaynes Technology, inaugurated its first international chip design centre in Muscat, Oman, in collaboration with Oman’s Ministry of Transport, Communications and Information Technology and the Ministry of Labour.</li><li>The VLSI design centre will focus on front-end and back-end chip design processes, aiming to train 80 to 100 students annually in advanced VLSI design technologies.</li><li>The Omani government fully funded the design centre, extending the plan of building a strong semiconductor ecosystem beyond India, supporting local governments.</li><li>Kaynes Semicon is progressing with plans to produce India’s first packaged semiconductor chip by July 2025 and has received approval to set up an Outsourced Semiconductor Assembly and Test facility in Sanand, Gujarat.</li></ul>

Kaynes Semicon Establishes First Overseas Chip Design Centre in Oman

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