MIT engineers have developed a new technology that could revolutionize the way semiconductor chips are made, making them more powerful and dense.
The technology uses ultrathin 2D materials to create semiconductor transistors, allowing them to be stacked more densely to make more powerful chips.
The new method developed by MIT researchers can "effectively and efficiently 'grow' layers of 2D transition metal dichalcogenide (TMD) materials directly on top of a fully fabricated silicon chip", which significantly reduces the time taken to grow the materials and is better suited for use in commercial applications.