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MIT engineers develop ultrathin transistor tech for super dense computer chips

  • MIT engineers have developed a new technology that could revolutionize the way semiconductor chips are made, making them more powerful and dense.
  • The technology uses ultrathin 2D materials to create semiconductor transistors, allowing them to be stacked more densely to make more powerful chips.
  • The new method developed by MIT researchers can "effectively and efficiently 'grow' layers of 2D transition metal dichalcogenide (TMD) materials directly on top of a fully fabricated silicon chip", which significantly reduces the time taken to grow the materials and is better suited for use in commercial applications.

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