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MIT’s new stacked chip design could revolutionize computing

  • MIT engineers have developed a new method for stacking chips without the need for bulky silicon layers.
  • The method allows for growing high-quality semiconductors directly on top of each other at low temperatures.
  • This breakthrough could lead to advanced chips powering AI, wearable devices, and laptops with improved computing power.
  • The technology paves the way for faster and more efficient electronics with increased storage capacities.

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