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Optimizing Chip Placement on Circular Wafers Using Breadth-First Search (BFS)

  • Semiconductor manufacturing involves fabricating microchips on circular silicon wafers.
  • Breadth-First Search (BFS) can be used to optimize chip placement, defect detection, and exposure path planning in wafer lithography.
  • The algorithm for BFS chip placement involves starting from the center of the wafer and expanding outward layer by layer to find valid chip positions.
  • BFS is also used for defect detection and isolation, as well as optimizing lithography exposure paths in a systematic scanning pattern.

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