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Report: Apple’s M5 chips will use TSMC’s N3P process and 2.5D packaging technology
- Apple's upcoming M5 line of Mac chips will be made using TSMC's three-nanometer N3P process.
- Some of the M5 chips will also utilize TSMC's 2.5D packaging technology.
- The M5 chips are expected to come in standard, Pro, Max, and Ultra editions.
- The chips will feature a new version of TSMC's three-nanometer node, offering higher performance or lower power usage.
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