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Rising power density and heat threaten the future of advanced semiconductors
- Moore's Law has led to exponential growth in computing power by doubling transistor count every two years, but rising heat from denser chips poses a challenge.
- Dennard scaling's end has resulted in increasing power density and heat generation as transistor size reduces.
- Addressing heat in advanced semiconductors is crucial, with new technologies like nanosheet transistors and CFETs exacerbating the thermal challenge.
- Researchers are exploring innovative cooling solutions like microfluidic cooling and immersion cooling to manage escalating power densities.
- Backside power-delivery networks and other strategies aim to reduce heat generation, but may not be universally applicable due to practical constraints.
- System-level approaches such as dynamic voltage and frequency adjustments are employed to manage temperatures in chips.
- Backside power delivery network technology could enhance energy efficiency by enabling operation at lower voltages and reducing heat generation.
- New thermal management techniques like thermal sprinting and relocating power delivery to the backside of chips show promise in addressing heat challenges.
- Innovations like 3D stacking and CMOS 2.0 aim to improve performance and energy efficiency, but introduce new thermal considerations that require thorough investigation.
- System technology co-optimization, integrating system design and process technology, is advocated to tackle thermal challenges in future chip development.
- Collaboration and advanced simulation tools are essential to anticipate and mitigate the mounting thermal issues faced by evolving semiconductor technologies.
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