<ul><li>Samsung Electronics plans to replace silicon interposers with glass substrates in chip packaging by 2028, marking a significant advancement in AI chip innovation and manufacturing efficiency.</li><li>The shift to glass interposers offers advantages over silicon options, providing more precision for circuits, better dimensional stability, and lower costs, crucial for the booming AI industry.</li><li>Samsung's strategy includes using smaller glass units for faster prototyping and optimizing production through its unique Panel-Level Packaging line, potentially enhancing its market entry speed.</li><li>This move aligns with Samsung's broader AI Integrated Solution approach, aiming to offer end-to-end chip solutions and bolster semiconductor revenue, positioning the company strongly in the competitive AI chip market.</li></ul>

Samsung to Replace Silicon with Glass in AI Chip Packaging by 2028

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