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Taking 3D IC Heterogeneous Integration Mainstream
- 3D IC heterogeneous integration, a system approach, disaggregates what would be implemented as an SoC into chiplets for improved performance at reduced cost and higher yield.
- System Technology Co-optimization (STCO) involves architectural planning, analysis, physical design, and electrical and reliability analysis in 3D IC design.
- The Chiplet Design Exchange (CDX) established within the Open Compute Project aims to promote 3D IC technology and create a chiplet ecosystem.
- The CDX group consists of EDA vendors, FABs, OSATs, and substrate material providers working on design kits for 3D IC integration.
- To support 3D IC design, four 3DKs are being developed: Chiplet Design Kits (CDK), Package Assembly Design Kits (PADK), Material Design Kits (MDK), and Package Test Design Kits (PTDK).
- CDK models are recommended for early planning and design, while PADK defines pitch spacing rules and material properties are defined by MDKs.
- MDKs provide material properties for thermal, stress, and signal integrity analysis, while PTDKs define test IO pins and functions.
- The 3DK models enable chiplet ecosystem development, allowing chiplet suppliers to describe their products and enable designers to choose suitable parts.
- The CDX group is working on authoring tools to create 3DK models in a machine-readable, open-source EDA-neutral format to propel 3D IC integration into mainstream design.
- Innovator3D IC by Siemens EDA offers a multi-physics cockpit for 3D IC design and manufacturing, facilitating planning and heterogeneous integration of ASICs and chiplets.
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