Both 60/40 and 63/37 solder are widely used in electronics for creating connections on printed circuit boards (PCBs). They have similar compositions, consisting of tin and lead, with tin being the primary component.
Both solder types have a melting point of approximately 183°C, good electrical conductivity, and are relatively easy to use.
The key differences between 60/40 and 63/37 solder lie in their eutectic properties, fluidity during soldering, strength and reliability of joints, and environmental considerations.
60/40 solder is non-eutectic, requires careful handling, and contains more lead, while 63/37 solder is eutectic, provides better fluidity during soldering, forms stronger joints, and contains slightly less lead.