<ul><li>Bigscreen Beyond 2's first shipping batches have been delayed to June, or late May if things go well.</li><li>The delay is due to a design flaw in a printed circuit board (PCB) in the headset affecting controller tracking.</li><li>The company has already produced 5000 PCBs with the flaw, which now have to be scrapped.</li><li>To scale up production and improve quality control, Bigscreen has hired new employees and is using computer vision for assessment.</li></ul>

Bigscreen Beyond 2 Shipping Delayed To June Due To PCB Design Flaw

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