<ul><li>Researchers at the University of Tokyo have developed a new way to cool electronic chips using advanced water-based systems.</li><li>The cooling method utilizes water's latent heat, which is seven times more powerful than sensible heat.</li><li>A special 3D network of microchannels, capillary structures, and a manifold layer are designed to manage the boiling process inside the chip.</li><li>The system's coefficient of performance (COP) reached up to 105, providing efficient cooling power for high-power electronics.</li></ul>

Boiling water to cool chips? New tech could supercharge your devices

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