menu
techminis

A naukri.com initiative

google-web-stories
source image

Medium

2d

read

98

img
dot

Image Credit: Medium

Bridging Borders: InnoForge Ventures Signs MOU with SSCIP and ITTC to Advance Cross-Border…

  • InnoForge Ventures has signed a Memorandum of Understanding (MOU) with SSCIP and ITTC to advance cross-border innovation programs.
  • The partnership aims to foster mutual trust and co-develop high-impact innovation programs, with InnoForge supporting SSCIP's vision of becoming a global innovation hub.
  • SSCIP, located in Chengdu’s High-Tech Zone, is a collaboration between Singapore and Sichuan governments, housing over 180 high-tech enterprises and supporting a thriving ecosystem with various amenities.
  • The International Technology Transfer Center (ITTC) plays a crucial role in transforming research into real-world impact by connecting China’s innovation hubs with global partners.

Read Full Article

like

5 Likes

For uninterrupted reading, download the app