UK-based semiconductor company Cambridge GaN Devices (CGD) has developed gallium nitride (GaN) technology that combines its ICeGaN HEMT integrated circuits (ICs) and Insulated-Gate Bipolar Transistors (IGBTs) in the same module for EV powertrain applications over 100 kW.
The Combo ICeGaN approach takes advangage of the fact that ICeGaN and IGBT devices can be operated in a parallel architecture. ICeGaN switch is highly efficient, offering a cost-effective alternative to silicon carbide (SiC) products.
At higher temperatures, the bipolar component of the IGBT starts to conduct at lower on-state voltages, supplementing the loss of current in the ICeGaN. Conversely, at lower temperatures, ICeGaN will take more current.
ICeGaN technology allows EV engineers to use GaN in DC-to-DC converters, on-board chargers, and potentially traction inverters. CGD's Combo ICeGaN is more economical than similar combinations with SiC MOSFETs.