<ul><li>A new method for creating soft, flexible electric connections across and through circuit layers may pave the way for advanced soft robotics and wearable devices.</li><li>The method uses liquid metal microdroplets to create vias, forming small conductive passages without needing drilled holes.</li><li>This technique allows for electronics that can stretch, bend, and twist while maintaining high functionality and durability.</li><li>The research was led by Michael Bartlett from Virginia Tech and was published in Nature Electronics.</li></ul>

New method paves way for electronics that bend and twist

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