<ul><li>A team of researchers led by Michael Bartlett at Virginia Tech has developed a new method for creating flexible electronics.</li><li>The method involves using liquid metal microdroplets to create soft, bendable connections across circuit layers.</li><li>These connections, called vias, enable the development of durable and comfortable gadgets and health devices.</li><li>The technology has potential applications in soft robotics, wearable technology, and other areas.</li></ul>

New tech brings flexible electronics closer to reality

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