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Nexperia offers automotive planar Schottky diodes in space-saving CFP2-HP packaging
- Dutch semiconductor company Nexperia is introducing a range of 16 new low VF optimized planar Schottky diodes in CFP2-HP packaging.
- The portfolio consists of eight industrial and eight automotive AEC-Q101 qualified products, catering to the shift towards smaller CFP-packaged devices in automotive applications.
- These diodes are ideal for applications like DC-DC conversion, freewheeling, and reverse polarity protection, among others.
- The diodes offer reverse voltages ranging from 20 V to 60 V and forward currents of 1 A and 2 A for design flexibility.
- The CFP2-HP package features an exposed heatsink for efficient heat dissipation in a compact footprint measuring 2.65 mm x 1.3 mm x 0.68 mm.
- The use of a copper clip design in the packages meets the demands of efficient and space-saving designs.
- Nexperia plans to extend this packaging technology to bipolar transistors in the near future.
- The company is also launching a low IR optimized portfolio of planar Schottky diodes for automotive and industrial use.
- According to Nexperia, the CFP packaging is crucial for thermal management in the industry's transition to multi-layer PCBs, offering electrical performance at a reduced footprint.
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