A naukri.com initiative
Semiengineering
1M
399
Image Credit: Semiengineering
Photonics Speeds Up Data Center AI
- Photonics plays a vital role in accelerating AI in data centers, with the optical components market reaching $17 billion in revenue last year.
- Datacom sector, particularly AI-driven data centers, now contributes over 60% to the optical components market, fueling the growth of optical technologies.
- The demand for high-bandwidth, low-latency networking solutions in AI data centers driven by the exponential growth of Large Language Models (LLMs).
- Transition from pluggable optics to Co-Packaged Optics (CPO) in scale-out network can significantly reduce power consumption and increase GPU density.
- Reliability is crucial when moving from copper to optics to CPO, especially in AI data centers where large volumes and high yields are imperative.
- Scale-up interconnects in AI data centers currently rely on copper-based solutions, but the shift towards CPO is imminent for future optical requirements.
- TSMC is deeply engaged in the development of AI chips and is preparing for co-packaged optics in their technology roadmap.
- The optical industry foresees widespread adoption of Co-Packaged Optics (CPO) by the 2030s, with the market projected to reach $5 billion by 2030.
- Early entrants like Broadcom, Marvell, Ayar Labs, Celestial AI, and Lightmatter stand to benefit from the growing CPO market alongside laser suppliers like Coherent.
- By the mid-2030s, it is predicted that all interconnects in data centers will be optical and Co-Packaged Optics will be integral to the infrastructure.
Read Full Article
24 Likes
For uninterrupted reading, download the app