<ul><li>Scientists at The University of Texas at Austin have developed a new cooling material called a 'thermal interface material' that efficiently moves heat away from electronic devices.</li><li>This breakthrough could lead to significant energy savings in data centers, which currently consume around 40% of their total energy for cooling.</li><li>In tests, the new cooling material demonstrated the ability to remove 2,760 watts of heat from a small area and potentially reduce the energy needed for cooling pumps by up to 65%.</li><li>The researchers are now working to scale up production and test the cooling material in real data centers, aiming to lower energy costs and reduce the environmental impact of data centers globally.</li></ul>

Revolutionary cooling material could slash data center energy costs by 65%

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