Researchers have developed an automated robotic system to streamline the transfer of 2D materials, such as graphene, from growth substrates to target platforms for industrial applications.
The system integrates robotics and advanced interface science to address challenges in manual transfer processes, enhancing material quality and throughput.
By modulating adhesion forces and strain during pickup, transfer, and deposition, the system maintains the integrity and quality of the atomically thin films.
The automated system achieves transfer with graphene carrier mobilities exceeding 14,000 cm²V⁻¹s⁻¹, indicating high electrical conductivity and preserved material quality.
It can process up to 180 wafers per day, offering industrially relevant throughput essential for semiconductor manufacturing and flexible electronics production.
The system reduces device-to-device variability, facilitating large-area applications and lowering barriers to market entry for 2D material-based devices.
In addition to improving device reproducibility, the automated system also addresses cost and environmental sustainability by minimizing waste and energy consumption.
Utilizing robotic arms with high-precision sensors and machine vision, the system adapts mechanical forces in real-time to ensure defect-free transfers.
The automated transfer method is versatile, extending beyond graphene to other 2D materials like TMDs and hexagonal boron nitride, enabling the fabrication of heterostructures for diverse applications.
The automated system significantly outperforms conventional manual processes in transferring 2D materials, providing higher carrier mobilities and quality with minimal defects, boosting adoption in industries.