<ul><li>Samsung Electronics plans to replace silicon with glass in a central component of chip packaging by 2028, aiming to enhance chip performance and lower costs.</li><li>This shift from silicon to glass is focused on improving interlayers used in chip packaging, particularly for 2.5D packaging integrating high-bandwidth memory with graphics processors.</li><li>Glass offers advantages over silicon in terms of cost-effectiveness, production versatility, thin circuit support, heat tolerance, and reliability under performance conditions.</li><li>Samsung's innovative approach of using glass in chip manufacturing reflects a forward-looking vision for faster, more efficient chips in the future, potentially setting a new standard in chip design by 2028.</li></ul>

Samsung to Replace Silicon with Glass in Future Chips

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