Scientists at Columbia Engineering have developed a technique using DNA to build tiny 3D electronic devices that can assemble themselves.
This method allows for the creation of smaller, smarter, and more powerful electronics, particularly for advanced technologies like artificial intelligence.
Traditional top-down manufacturing methods for creating 3D electronics have been slow and expensive, but this new bottom-up approach inspired by nature uses DNA strands to form the base structure.
The researchers successfully created self-assembled 3D electronic devices, such as light sensors, by guiding DNA shapes to link together to form 3D structures, proving the effectiveness of the method.