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Smart Chips, Safe Trips: How DFT Powers the Future of Autonomy with Vijayaprabhuvel Rajavel
- The U.S. Department of Commerce announces $1.4 billion in new awards under the CHIPS National Advanced Packaging Manufacturing Program to establish a domestic ecosystem for advanced chip design, fabrication, and packaging.
- Design for Testability (DFT) plays a critical role in ensuring the safety and reliability of complex chips for sectors like autonomous vehicles and defense systems.
- Vijayaprabhuvel Rajavel, a Technical Architect at HCL America, highlights the importance of DFT in the context of the CHIPS Act and the shift toward localized manufacturing and packaging.
- DFT enables data continuity and faster yield learning, crucial for safety-critical domains such as defense and automotive.
- In complex ASIC designs for chiplets and autonomous systems, DFT requires modular, RTL-aware approaches to ensure fault coverage and traceability.
- Early integration of DFT in high-risk applications like self-driving vehicles is essential for meeting safety standards and production timelines.
- Improving scan coverage in complex designs involves tailored strategies, wrapper insertion, and automating DRC cleanup.
- Balancing thorough testing with minimizing power consumption in semiconductor designs requires toggle-aware pattern generation and power domain analysis.
- Engineers need strong digital design, testing, and data skills to adapt to the changing landscape of DFT, especially with the influence of AI/ML.
- Machine learning is shaping the future of DFT by optimizing test flows, predictive pattern generation, and integrating AI automation for smarter and more adaptable testing.
- ML accelerates DFT through predictive pattern generation, adaptive test flow, and generative AI automation, enabling intelligent, self-learning test systems for advanced nodes and heterogeneous integration.
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