Researchers at POSTECH have created a dry adhesive using shape memory polymers that can stick to and release micro-LED chips without glue.
Micro-LEDs are small powerful lights for advanced screens, but placing them accurately has been challenging.
The smart adhesive developed can switch between 'stick' and 'release' states by heating, holding objects strongly and releasing them with minimal force.
The new material could revolutionize manufacturing by enabling cleaner, more precise handling of delicate parts in electronics and displays.