<ul><li>Scientists from Nagoya University in Japan have created an ultra-thin loop heat pipe (UTLHP) that can keep mobile devices cool and improve performance.</li><li>The UTLHP is only 0.3 millimeters thick but can handle high levels of heat, allowing for slimmer designs.</li><li>It uses a closed-loop system to absorb and transfer heat, without the need for electricity.</li><li>The UTLHP is 45 times more efficient than regular copper for heat transfer, making it a potential game-changer for smartphones and tablets.</li></ul>

Ultra-thin heat pipe could make phones faster and slimmer

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