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Understanding Test Quality In Semiconductor Devices: An Overview
- The testing process is designed to catch defects in semiconductor devices, which could prevent the device from functioning correctly, leading to failures at time zero or in the field.
- The effectiveness or “thoroughness” of a semiconductor device test is measured by its coverage.
- The quality of the test is often quantified by the likelihood of a “test escape”, which refers to a defect going undetected.
- Defect mechanisms have become more subtle in advanced semiconductor technologies, making them harder to detect.
- As the devices become more complex, new challenges like die matching have emerged, which add a layer of complexity to the testing process.
- There are several different types of tests used to ensure semiconductor devices meet their specifications, including continuity/contact resistance (CRES), DC Parametrics, Leakage Tests, Electrical Chip ID (ECID), Low Voltage and Nominal Voltage Structural Tests, Stress Tests, and Parametric Tests.
- Test data analytics plays a critical role in resolving the balance between test quality and cost.
- AI/ML models are being integrated into test flows to optimize test processes further, offering faster identification of defects with minimal human intervention.
- The Advantest ACS Real-Time Data Infrastructure (ACS RTDI) empowers customers to boost yield, enhance product quality, and accelerate time to market with cutting-edge real-time data solutions and AI/ML-driven analytics.
- By leveraging comprehensive data, using advanced models, and optimizing test flows, manufacturers can maintain high product quality while controlling costs.
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